CMP pad processing equipment and inspection equipment
A processing technology that maximizes the performance of CMP pads, contributing to the stabilization of polishing performance and reduction of running costs through uniform surface processing!
The CMP pad processing and inspection device "CMP1100S" is a dedicated processing device that performs high-precision surface processing of CMP pads used in the CMP (Chemical Mechanical Polishing) process. In semiconductor manufacturing, the condition of the CMP pad surface significantly affects polishing quality and processing accuracy. This device uniformly processes the CMP pad surface using unique processing technology, maintaining stable polishing performance. Furthermore, by combining it with the pad surface inspection device "INS800SA," it visualizes the surface condition after processing, providing consistent support for quality control. It can be widely utilized from research and development applications to mass production lines.
- Company：東邦エンジニアリング
- Price：Other
